CLC 15-150 A/B

A two component, heat cure epoxy system specifically developed for use on instrument and power transformers. The cured material exhibits excellent thermal stability and thermal cycling endurance. Product meets UL 94-HB flammability requirements. CLC 15-150 A/B

CLP 7106 / CLI 4010

Flexible polyurethane system for potting and casting in electrical applications. A two component, low viscosity, low durometer, polyurethane potting compound. The cured material meets the requirements of UL94-V0. CLP 7106 / CLI 4010

CLP 7330 / CLI 4161

Economical, flexible, potting and casting polyurethane system. a solventless, low viscosity, flexible, two component polyurethane casting resin. CLP 7330 / CLI 4161

CLR 1020 / CLH 6021

Semi-flexible epoxy adhesive and casting system. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1020 / CLH 6021

CLR 1026 / CLH 6021

Low viscosity, semi-flexible. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1026 / CLH 6021

CLR 1066 / CLH 6520

Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance. CLR 1066 / CLH 6520

CLR 1157 / CLH 5515

Heat Cure Semi-Rigid Epoxy Transformer Casting System. Increased flexibility when compared to CLR 1331 / CLH 5515 family. System exhibits excellent thermal stability and thermal cycling performance. A two component, heat cure epoxy system specifically developed for use on instrument and power transformers. Product meets UL94-HB flammability requirements. CLR 1157 / CLH 5515

CLR 1180 / CLH 6520

Flexible epoxy casting and potting system. An unfilled, semi-flexible epoxy casting system with long pot life. This product may be used in large mass casting. CLR 1180 / CLH 6520

CLR 1190 / CLH 6560

Low viscosity, RT cure. Impact resistant. Excellent thermal cycle. An exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance. CLR 1190 / CLH 6560

CLR 1205 / CLH 6770

Clear low viscosity semi-flexible adhesive / sealant. A low viscosity, two component unfilled, room temperature cure epoxy system. CLR 1205 / CLH 6770

CLR 1556 / CLH 6510

Good thermal cycling, 2:1 mix by volume. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance. CLR 1556 / CLH 6510

CLR 1556 / CLH 6520

Soft 50/40D, Slow gel - Electronic Modules, Machinable. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance. CLR 1556 / CLH 6520

CLR 1556 / CLH 6640

Room Temperature Cure, filled epoxy system suitable for machine dispense. Developed for potting and casting of electrical and electronic components. The cured material exhibits excellent thermal cycling endurance. CLR 1556 / CLH 6640

CLR 1710 / CLH 6710

Abrasion Resistant Epoxy. An abrasion resistant, two component epoxy surface coat. CLR 1710 / CLH 6710

CLR 1946 / CLH 6500

Product is recommended for potting and encapsulating applications. A two component, room temperature cure semi-flexible epoxy system. The system was developed for potting / casting of electrical and electronic components. Its use of non abrasive fillers and convenient 1:1 ratio by volume, makes it ideal for use in machine dispensing equipment. CLR 1946 / CLH 6500

CLR 3507 / CLH 6230

A semi-flexible, 100% solid, epoxy system. This product was specifically developed for potting / casting of electrical and electronic components. The long pot life of the material makes it suitable for large mass castings or heat induced curing with minimal stress. Product passes UL94-HB in-house flammability testing. For a more rigid system, CLR 3517 / CLH 6230 is recommended. CLR 3507 / CLH 6230

CLS 9611

A low viscosity, single component, epoxy potting and encapsulating compound. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL 94-HB flammability requirements. Heat Cure Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. CLS 9611

CLS 9616

Heat Cure. Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. Low viscosity. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL94-HB flammability requirements. CLS 9616

XID 1681 / XHD 1652

A two component polyurethane casting system. Product has long pot-life and cures to a hardness of 65 Shore D. XID 1681 / XHD 1652

XPD 1401 / CLI 4182

Density = 0.80. A low viscosity, low density, user-friendly, room temperature cure, MDI based polyurethane system. The product cures to a hardness of 60 shore A, and has a cured density of 0.80 gms/cm3. XPD 1401 / CLI 4182